Film thickness metrology

ABSTRACT

Methods for determining a target thickness of a conformal film with reduced uncertainty, and an integrated circuit (IC) chip having a conformal film of the target thickness are provided. In an embodiment, a first critical dimension of a structure disposed on a wafer is measured. Said structure has at least one vertical surface. A first conformal film is deposited over the structure covering each of a horizontal and the vertical surface of the structure. A second critical dimension of the covered structure is then measured. The target thickness of the conformal film is determined based on difference between the first CD measured on the structure and the second CD measured on the covered structure.

FIELD

The disclosure relates generally to production of integrated circuitchips, and more particularly to controlling film thickness on verticalsidewalls of features of IC chips.

BACKGROUND

Integrated circuit (IC) chip production is challenged by complexthree-dimensional structures and films associated with these structures.Controlling film thickness on sidewalls of vertical surfaces ofstructures is crucial to proper operation of integrated circuits.

Optical techniques such as scatterometry have been used to assesssidewall film thickness. Scatterometry requires accurate andtime-consuming modeling of an entire complex three-dimensional structurein order to achieve accurate measurements of sidewall film thickness.Moreover, accuracy can only be attained if most or all other parametersare tightly controlled, and measurement devices are calibrated accordingto the specific set of parameters. Such parameters include, for example,the composition of all films, surface roughness, featuremorphology/shape, etc. This is due to the complex signature of thereflected signal. Even with tight control of the features, it remainsdifficult to reliably tease out an accurate film thickness measurementfrom the scatterometry signal. The utility of scatterometry methods areparticularly limited in production mode.

Other techniques to assess sidewall film thickness include scanningelectron microscopy (SEM) or transmission electron microscopy (TEM).However, taking cross sections to perform these techniques isdestructive to the IC chip, and therefore substantially incompatiblewith use in production mode. It is also slow to perform, and produces alimited quantity of data.

BRIEF DESCRIPTION

Aspects of the invention provide a method of determining a targetthickness for a conformal film disposed over a structure having at leastone vertical sidewall on an IC chip, and an IC chip having a conformalfilm of the determined target thickness.

A first aspect of the disclosure provides a method including: measuringa first critical dimension (CD) of a structure disposed on a wafer, thestructure having at least one vertical surface; depositing a firstconformal film over the structure to form a coated structure, whereinthe first conformal film covers each of a horizontal and the verticalsurfaces of the structure; measuring a second CD of the coatedstructure; and determining a target first conformal film thickness basedon a difference between the first CD and the second CD.

A second aspect of the disclosure provides a method including:depositing a first conformal film over a wafer having a structurethereon, thereby forming a coated structure, the structure including atleast one vertical surface and at least one horizontal surface;measuring a first critical dimension (CD) of the structure; performingan etch to remove a partial thickness of the first conformal film fromeach of the at least one vertical surface and at least one horizontalsurface; measuring a second CD of the coated structure; and determininga target first conformal film thickness based on a difference betweenthe first CD and the second CD.

A third aspect of the disclosure provides an integrated circuit (IC)chip including: a wafer; at least one structure having at least onevertical surface, the at least one structure being formed on the wafer;and a first conformal film deposited over the wafer including the atleast one structure, wherein the first conformal film has a first targetthickness, and wherein the first target thickness is represented by theequation: t=½ [CD1−CD2]. In this equation, t=the first target thickness;CD1=a first critical dimension (CD); and CD2=a second CD.

These and other aspects, advantages and salient features of theinvention will become apparent from the following detailed description,which, when taken in conjunction with the annexed drawings, where likeparts are designated by like reference characters throughout thedrawings, disclose embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-3 show an illustrative IC chip in various steps in a method inaccordance with an embodiment of the invention.

FIG. 4 shows an IC chip in accordance with an embodiment of theinvention.

FIGS. 5-6 show IC chips in accordance with further embodiments of theinvention.

FIGS. 7-8 show an IC chip in various steps in a method in accordancewith an embodiment of the invention.

DETAILED DESCRIPTION

As indicated above, aspects of the invention provide a method fordetermining a target thickness for a conformal film disposed over atleast one three-dimensional feature on an IC chip, as well as an IC chiphaving a conformal film of a target thickness disposed thereon.

With reference to FIGS. 1-4, a method of determining the targetthickness of a conformal film layer is illustrated. As shown in FIG. 1,an IC chip 1 is provided. IC chip 1 may include a number of electroniccircuits manufactured by lithographic processes or patterned diffusionof trace elements into the surface of a wafer 10 in a conventionalmanner. In particular, a structure 20 having at least one verticalsurface 30 and horizontal surface 55 is formed. In FIG. 1, structure 20is a trench. In other embodiments, however, structure 20 may be a raisedfeature such as, for example, a fin or a ridge (FIG. 4). In variousother embodiments not shown, structure 20 may be any other type offeature which is symmetrically coated, such that the structure includesdual films measured with a single delta critical dimension (CD)measurement.

Referring back to FIG. 1, a first critical dimension (CD) 40 ofstructure 20 is measured. This measurement, and others described furtherherein, may be performed using critical dimension scanning electronmicroscopy (CD SEM), atomic force microscopy (AFM), or other suitabletechniques. In embodiments such as shown in FIGS. 1-3, where structure20 is a trench, first CD 40 represents the width of the trench asformed, prior to the deposition of any subsequent films or layers. Inother embodiments, such as shown in FIG. 4, where structure 20 may be araised feature, first CD 40 represents the width of the structure 20prior to the depositing of the first conformal film 50.

Following measurement of first CD 40, a first conformal film 50 may bedeposited over structure 20 as shown in FIG. 2, to form coated structure25. First conformal film 50 is deposited over each of a horizontalsurface 55 and a vertical surface 30 of structure 20. As shown in FIG.2, where structure 20 is a trench, first conformal film 50 may bedeposited such that a measurable trench opening 57 remains betweenvertical sidewalls 56, 58 on an outer surface of coated structure 25,i.e., the trench is not entirely filled during deposition of firstconformal film 50. As shown in FIG. 4, in embodiments in which thestructure 20 is a raised feature, first conformal film 50 is similarlydeposited over each of a horizontal surface 55 and a vertical surface 30of structure 20, forming coated structure 25.

After deposition of first conformal film 50, a second CD 60 is measured.As shown in FIGS. 2-3, in embodiments in which coated structure 25 is acoated trench, second CD 60 represents a width of the trench opening 57between vertical sidewalls 56, 58 on an outer surface of first conformalfilm 50, i.e., second CD 60 represents a width of trench opening 57 infirst conformal film 50 (FIG. 2). As noted above, CD 60 measures greaterthan 0 nm, because first conformal film 50 does not fill trench opening57. Other units of distance besides nanometers may of course be used asappropriate to the scale of the coated structure 25. In the embodimentshown in FIGS. 2-3, second CD 60 may be smaller than first CD 40. Inembodiments such as shown in FIG. 4, in which coated structure 25 is araised feature, second CD 60 represents a width of coated structure 25,i.e., a distance between vertical sidewalls 56, 58. In this embodiment,second CD 60 may be greater than first CD 40. A difference between firstCD 40 and second CD 60 forms the basis for a determination of a targetthickness for first conformal film 50.

In particular, as shown in FIG. 3, in various embodiments, the targetthickness 70 of first conformal film 50 can be determined using themeasurements of first CD 40 and second CD 60 using Equation 1:t=|½[CD1−CD2]|  Equation 1:

where t=a target thickness 70 of first conformal film 50; CD1=first CD40; and CD2=second CD 60. Thus, target thickness 70 of first conformalfilm 50 is equal to the absolute value of one half the differencebetween first CD 40 and second CD 60.

In further embodiments, the target thickness 70 of first conformal film50 can be determined with greater precision, taking into accountuncertainties associated with the measurements of each of the first CD40 and second CD 60. Each measurement, e.g., of first CD 40 and secondCD 60, has an associated uncertainty regarding the precision of themeasurement. In such an embodiment, the target thickness 70 of firstconformal film 50 is determined according to Equation 2:t=|½[CD1−CD2±√(δ₁ ²+δ₂ ²)]|  Equation 2:

where t=a target thickness 70 of first conformal film 50; CD1=first CD40; and CD2=second CD 60; δ₁=an uncertainty associated with themeasurement of CD1; and δ₂=an uncertainty associated with themeasurement of CD2. As in Equation 1, target thickness 70 of firstconformal film 50 is equal to the absolute value of one half thedifference between first CD 40 and second CD 60, however, in Equation 2,the difference between first CD 40 and second CD 60 is ± one half of√(δ₁ ²+δ₂ ²), thus accounting for a uncertainty in the measurements of twhile reducing it by half.

Use of this formula to determine target thickness 70 of first conformalfilm 50 facilitates a determination which is subject to half theuncertainty that would typically be accorded to such a target thickness70 calculation due to the dual sidewall coating inherent in a conformalfilm coating.

In various embodiments, after target thickness 70 of first conformalfilm 50 is determined, target thickness 70 may be adjusted eitherthrough further deposition or removal of a partial thickness of firstconformal film 50. In other embodiments, the determined target thickness70 will provide process control and feedback regarding the depositionprocess, and may be fed forward to subsequent measurements. Hybridmetrology takes advantage of prior knowledge of thickness of firstconformal film 50 to reduce computational complexity relative to havingan unknown thickness of first conformal film 50 in scatterometry, atomicforce microscopy, etc., and processing steps including compensations forfilms which are too thin or too thick.

In further embodiments, as shown in FIG. 5, the above process can berepeated to determine a target thicknesses 95 of subsequently depositedsecond conformal film 80. For example, after measuring the second CD 60of coated structure 25, a second conformal film 80 may be deposited overcoated structure 25, including structure 20 and first conformal film 50.Second conformal film 80 covers each of a horizontal and a verticalsurface of coated structure 25, in a manner similar to first conformalfilm 50 covering structure 20. In embodiments such as FIG. 5, in whichcoated structure 25 is a coated trench, a measurable space 97 remainsbetween vertical sidewalls 96, 98 on an outer surface of first conformalfilm 80, within the coated trench.

After deposition of second conformal film 80, a third CD 90 is measured.As shown in FIG. 5, in embodiments in which coated structure 25 is acoated trench, third CD 90 represents a width of space 97 betweenvertical sidewalls 96, 98 on an outer surface of first conformal film 80in the trench. Third CD 90 measures greater than 0 nm; as with second CD60, other units of distance may of course be used as appropriate to thescale of the coated structure 25. In embodiments such as shown in FIG.6, in which structure 20 is a raised feature, second CD 60 represents awidth of the structure as coated by first conformal film 50, i.e., adistance between vertical sidewalls 56, 58. Third CD 90 represents awidth of coated structure 25 as coated by first conformal film 80, i.e.,a distance between vertical sidewalls 96, 98. A difference betweensecond CD 60 and third CD 90 form the basis for a determination of asecond target thickness 95 for second conformal film 80.

In particular, as shown in FIGS. 5-6, in various embodiments, the targetthickness 95 of second conformal film 80 can be determined using themeasurements of second CD 60 and third CD 90 using Equation 3:t ₂=|½[CD2−CD3±√(δ₂ ²+δ₃ ²)]|  Equation 3:

where t₂=second target thickness 95 of second conformal film 80;CD2=second CD 60; CD3=third CD 90; δ₂=an uncertainty associated with ameasurement of CD2; and δ₃=an uncertainty associated with a measurementof CD3.

The foregoing methods may further be applied to etching processes inaddition to depositions of conformal films 50, 80 in order to determinetarget thicknesses. In such embodiments, as shown in FIG. 7, a firstconformal film 50 may be disposed over a wafer 10 having a structure 20thereon, forming coated structure 25. Structure 20 may have at least onevertical surface 30 and at least one horizontal surface 55 as describedabove. A first CD 100 of the coated structure 25 may be measured asdescribed above. For example, CD SEM or AFM techniques may be used.First CD 100 represents the width of the trench opening 57 betweenvertical side walls 56, 58 of first conformal layer 50. An etch 110 maythen be performed to remove at least a partial thickness of the firstconformal film 50 from the horizontal 55 and vertical surfaces 30 ofstructure 20. Various techniques, including reactive ion etching (RIE),focused ion beam (FIB) milling, wet chemistry etching, and others thatwill be known to those skilled in the art, may be used.

Turning to FIG. 8, second CD 120 may then be measured. Where, as in FIG.8, structure 20 is a trench, second CD 120 may be larger than first CD100. Where structure 20 is a raised structure (similar to that of FIG.4), the opposite may be the case. A target thickness 130 of firstconformal film 50 may then be determined based on first CD 100 and thesecond CD 120 in a fashion similar to that described above, e.g.,according to one of Equations 1 or 2. Additionally, the method describedwith regard to FIGS. 7-8 may be performed on successive layers/filmssimilar to the description accompanying FIGS. 5-6.

The disclosure further provides an integrated circuit (IC) chip producedaccording to the previously described methods.

With reference to FIGS. 2-3, in an embodiment, IC chip 1 includes awafer 10, and at least one structure 20 formed on the wafer 10, thestructure 20 having at least one vertical surface 30. Structure 20 maybe a trench, as in FIG. 3, or a raised feature such as a raised fin orridge, as in FIG. 4. A first conformal film 50 is disposed over thewafer 10 including the at least one structure 20, wherein the firstconformal film 50 has a first target thickness 70. Collectively,structure 20 and first conformal film 50 may be referred to as coatedstructure 25. First target thickness 70 of first conformal film 50 maybe determined according to one of Equations 1 or 2, described above. Infurther embodiments, a second conformal film 80 may be disposed abovefirst conformal film 50, having target thickness 95. Target thickness 95may be determined according to Equation 3, described above.

As used herein, the terms “first,” “second,” and the like, do not denoteany order, quantity, or importance, but rather are used to distinguishone element from another, and the terms “a” and “an” herein do notdenote a limitation of quantity, but rather denote the presence of atleast one of the referenced item. The modifier “about” used inconnection with a quantity is inclusive of the stated value and has themeaning dictated by the context (e.g., includes the degree of errorassociated with measurement of the particular quantity). The suffix“(s)” as used herein is intended to include both the singular and theplural of the term that it modifies, thereby including one or more ofthat term (e.g., the metal(s) includes one or more metals). Rangesdisclosed herein are inclusive and independently combinable (e.g.,ranges of “up to about 25 mm, or, more specifically, about 5 mm to about20 mm,” is inclusive of the endpoints and all intermediate values of theranges of “about 5 mm to about 25 mm,” etc.).

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. An integrated circuit (IC) chip comprising: awafer; at least one structure having at least one vertical surface andat least one horizontal surface, the at least one structure beingdisposed on the wafer; and a first conformal film over the waferincluding the at least one vertical surface and the at least onehorizontal surface of the at least one structure, wherein the firstconformal film has a first target thickness, an altered first targetthickness and a desired thickness, and wherein the first targetthickness is represented by the following equation:t=|½[CD1−CD2]| where t=the first target thickness; CD1=a first criticaldimension (CD) of the structure without the first conformal film; andCD2=a second CD of the first conformal film over the structure, whereinthe first target thickness is approximately less than the desired targetthickness and is configured to be altered by an added amount of thefirst conformal film; and wherein the altered target thickness of thefirst conformal film is approximately equal to the desired thickness ofthe first conformal film.
 2. The IC chip of claim 1, wherein thestructure is a trench, wherein the first CD is a width of the trench,and wherein the second CD is a width of a trench opening in the firstconformal film.
 3. The IC chip of claim 1, wherein the structure is araised feature, and the raised feature is one of a fin or a ridge,wherein the first CD is a width of the raised feature, and wherein thesecond CD is a combined width of the raised feature and the firstconformal film over the raised feature.
 4. The IC chip of claim 1,wherein the first target thickness accounts for an uncertaintyassociated with each of the first CD and the second CD, wherein thefirst target thickness is further represented by the equation,t=|½[CD1−CD2±√(δ₁ ²+δ₂ ²)]| where t=first-target thickness; CD1=thefirst CD; CD2=the second CD; δ₁=an uncertainty associated with ameasurement of CD1; and δ₂=an uncertainty associated with a measurementof CD2.
 5. The IC chip of claim 2, wherein the at least one verticalsurface includes a sidewall of the trench and the at least onehorizontal surface includes a bottom surface of the trench.
 6. The ICchip of claim 3, wherein the at least one vertical surface includes asidewall of the raised structure and the at least one horizontal surfaceincludes a top surface of the raised structure.
 7. The IC chip of claim1, further comprising: a second conformal film over the wafer includingthe at least one vertical surface and at least one horizontal surface ofthe at least one structure, wherein the second conformal film has asecond target thickness, and wherein the second target thickness isrepresented by the following equation:t ₂=|½[CD2−CD3]| where t₂=the second target thickness; CD2=the secondCD; and CD3=a third CD.
 8. An integrated circuit (IC) chip comprising: awafer; at least one structure having at least one vertical surface andat least one horizontal surface, the at least one structure beingdisposed on the wafer; and a first conformal film over the waferincluding the at least one vertical surface and the at least onehorizontal surface of the at least one structure, wherein the firstconformal film has a first target thickness, a desired thickness and analtered first target thickness, and wherein the first target thicknessis represented by the following equation:t=|½[CD1−CD2]| where t=the first target thickness; CD1=a first criticaldimension (CD) of the structure without the first conformal film; andCD2=a second CD of the first conformal film over the structure, whereinthe first target thickness is approximately larger than the desiredthickness and is configured to be altered by a subtracted amount of atleast a partial thickness of the first conformal film; and wherein thealtered target thickness of the first conformal film is approximatelyequal to the desired thickness of the first conformal film.
 9. The ICchip of claim 8, wherein the structure is a trench, wherein the first CDis a width of the trench, and wherein the second CD is a width of atrench opening in the first conformal film.
 10. The IC chip of claim 8,wherein the structure is a raised feature, and the raised feature is oneof a fin or a ridge, wherein the first CD is a width of the raisedfeature, and wherein the second CD is a combined width of the raisedfeature and the first conformal film over the raised feature.
 11. The ICchip of claim 8, wherein the first target thickness accounts for anuncertainty associated with each of the first CD and the second CD,wherein the first target thickness is further represented by theequation,t=|½[CD1−CD2±√(δ₁ ²+δ₂ ²)]| where t=first target thickness; CD1=thefirst CD; CD2=the second CD; δ₁=an uncertainty associated with ameasurement of CD1; and δ₂=an uncertainty associated with a measurementof CD2.
 12. The IC chip of claim 9, wherein the at least one verticalsurface includes a sidewall of the trench and the at least onehorizontal surface includes a bottom surface of the trench.
 13. The ICchip of claim 10, wherein the at least one vertical surface includes asidewall of the raised structure and the at least one horizontal surfaceincludes a top surface of the raised structure.
 14. The IC chip of claim8, further comprising: a second conformal film over the wafer includingthe at least one vertical surface and at least one horizontal surface ofthe at least one structure, wherein the second conformal film has asecond target thickness, and wherein the second target thickness isrepresented by the following equation:t ₂=|½[CD2−CD3]| where t₂=the second target thickness; CD2=the secondCD; and CD3=a third CD.